Advantest

October 23, 2013

3D-IC focus for GSA’s Taipei Memory+ event next week

Packed one-day event has speakers from Cadence, TSMC, Samsung, Amkor, Advantest and more providing a senior level view of making 3D-IC a reality. Registration closes soon.

Article | Topics: Conferences, Design to Silicon | Tags: 2.5D-IC, 2.5DIC, 3D-IC, 3DIC, memory, packaging, test | Organizations: Advantest, Amkor, Cadence Design Systems, GSA, Packaging, Rambus, Samsung Electronics, TSMC

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