RDL


July 19, 2021

Chiplet design raises big questions

Building products using chiplets involves more than treating them as hard IP cores. Many open questions surround the field, explored by panelists in a MEPTEC conference online.
Article  |  Topics: Blog - EDA, IP, PCB  |  Tags: , , , ,   |  Organizations: , , ,
January 19, 2021

Design house recommends earlier start to flip-chip bump layout

Design-services company Sondrel is recommending teams start earlier on package design to avoid delays after IC tapeout.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , ,   |  Organizations:

PLATINUM SPONSORS

Synopsys Cadence Design Systems Mentor - A Siemens Business
View All Sponsors