Mentor, a Siemens business, has formed an alliance with foundries and OSAT providers and launched a flow that brings IC and package design together.
Stacked 3D-IC memory-on-logic is on the packaging company's roadmap, but there are still yield hurdles to scale at the MEOL.
Packed one-day event has speakers from Cadence, TSMC, Samsung, Amkor, Advantest and more providing a senior level view of making 3D-IC a reality. Registration closes soon.
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