Flow evolution for the 3DIC/chiplet age
Chiplet-based 3DIC designs present new challenges for flows that integrate tasks from design exploration to physical verification.
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Mentor unites chip-to-package flow with Xpedition Package Integrator
Flow draws on existing strengths in Xpedition, Valor, Nimbic and Flotherm among others to optimize 3D design projects and improve cross-disciplinary communication.
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