Take a deeper dive into BCI-ROM
A new paper looks at examples for using The Boundary Condition Independent Reduced Order Model (BCI-ROM) in its VHDL-AMS implementation for electro-thermal analysis.
thermal
Flow evolution for the 3DIC/chiplet age
Chiplet-based 3DIC designs present new challenges for flows that integrate tasks from design exploration to physical verification.
Mentor unites chip-to-package flow with Xpedition Package Integrator
Flow draws on existing strengths in Xpedition, Valor, Nimbic and Flotherm among others to optimize 3D design projects and improve cross-disciplinary communication.