thermal

March 24, 2015

Mentor unites chip-to-package flow with Xpedition Package Integrator

Flow draws on existing strengths in Xpedition, Valor, Nimbic and Flotherm among others to optimize 3D design projects and improve cross-disciplinary communication.

Article | Topics: Blog - EDA, Embedded, - General, Blog - PCB | Tags: 3DIC, DRC, ECO, electromagnetic, IP, packaging, physical design, power integrity, signal integrity, silicon interposer, thermal | Organizations: Mentor Graphics

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