Dennard scaling


July 21, 2020

3D integration technologies will blend says TSMC chief scientist

DTCO and 3D integration will dominate scaling in the coming decade, TSMC chief scientist Philip Wong claimed in his keynote at DAC on Monday
Article  |  Topics: Blog - EDA  |  Tags: , , , , ,   |  Organizations: ,
June 2, 2015

Facing a future of dark silicon

Dennard’s Scaling ended years ago and Moore’s Law is slowing down. What will the future hold for the semiconductor industry?
Article  |  Topics: Blog - EDA  |  Tags: , ,   |  Organizations: ,

PLATINUM SPONSORS

Synopsys Cadence Design Systems Mentor - A Siemens Business
View All Sponsors