IEDM late last year showed how MRAM is being prepared for both FD-SOI and advanced finFET nodes.
Concerns that the diplomatic stand-off between Seoul and Tokyo could hit the supply chain rose again this weekend as South Korean politicians made a surprise visit to disputed islands.
The Chinese memory module specialist will preview the 2020 launch of its new solution based on the ultra low latency XL-Flash technology from Toshiba.
Despite the intense R&D going into storage-class and other novel forms of non-volatile memories, flash is set to continue as the bulk memory of choice, Micron executive claims in VLSI Symposia keynote.
Microsemi has launched a family of non-volatile FPGAs that use a 28nm process to increase density over the previous SmartFusion devices.
About 1,600 new UVM System Verilog verification IP memory models will cut testbench development time and offer more time to increase coverage.
A novel approach to 3D NAND will be among the presentations at the International Electron Device Meeting to be held in Washington, DC in December.
Altera has moved to a 55nm embedded flash process to continue its Max series of non-volatile FPGAs.
TSMC has launched three processes the foundry is aiming at internet-of-things (IoT) and wearable-device designs, providing lower-leakage versions of its 55nm, 40nm and 28nm processes.
HCC Embedded has developed a specialised filesystem for smart meters designed to reduce power consumption and increase flash memory lifetime.
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