August 27, 2019
GlobalFoundries is calling for imports of chips fabbed by TSMC into the US and Germany in multiple actions based on a list of 16 patents.
February 11, 2016
The Calibre vendor will have a strong technical presence at the leading lithography conference taking place in late February in San Jose.
December 11, 2015
According to ARM's Greg Yeric in his keynote at IEDM, even with cost improvements for multiple patterning, fewer designs will see the benefit of further silicon node scaling. Savings will come from design.
June 18, 2015
Is the industry ready to go beyond 10nm when it comes to lithography? Lithography researcher Professor David Pan sees design and process co-operation as the key approach.
June 16, 2015
HiSilicon claims close collaboration with foundry and EDA tools partners helped speed up plans to tape out the first 16nm finFET-based design through TSMC.
December 16, 2014
The International Electron Device Meeting (IEDM) has once again provided a chance for the major chipmakers to go head-to-head with their latest processes - this time with finFETs.
November 24, 2014
In a presentation at the recent ARM TechCon, HiSilicon described the issues in putting together a 16nm finFET-based design built around a cluster of ARM’s Cortex A57 processors.
November 4, 2014
Are we torn between evolution and revolution? Mentor Graphics' Joe Sawicki discusses how pattern matching already in fabs could move up and radically alter the design flow.
October 3, 2014
ARM has launched a pair of tools designed to improve the density and performance of finFET designs that use the company's physical libraries.
September 11, 2014
EUV may be getting most R&D cash but the world's biggest foundry says e-beam currently has the edge on defects and double patterning.