Imec proposes using stacked CMOS transistors and buried power rails to improve density for the 3nm process node.
Cadence and Imec have worked together on a project to tape out a test chip to explore manufacturing and design-rule options for the interconnect on future 3nm processes.
Innovation and advances in EUV and OPC lead Mentor's offerings at SPIE in San Jose later this month.
DTCO work by GlobalFoundries and Qualcomm reported at VLSI Symposia shows the need to minimize fin counts in future finFET processes.
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