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EDA

  1. Future of thermal simulation
    Article The future of thermal simulation for electronics products

    Complexity and the increasing use of thermal analysis software by non-expert designers demands new approaches for chip and PCB implementations.

  2. Article How to use PCI Express in low-power mobile SoCs by exploiting M-PCIe
  3. Guide Monolithic 3DIC for SoC

PCB

  1. High-speed I/O eye diagram - thumbnail
    Article Zeroing in on the problems of fast board-level interconnect

    A panel session at DAC 2014 focused on the problems of high-speed, board-level interconnect and the roles of codesign and power integrity in solving them.

  2. Expert Insight Straighten up and fly right
  3. Expert Insight Make best-practice lean NPI for PCB a reality

IP

  1. Dopant-level trojan standard cell developed by Georg Becker and coworkers
    Guide Hardware trojan attacks and countermeasures

    IC designers are becoming increasingly worried about the possibility of third parties inserting malicious ‘trojan’ circuitry into their ICs.

  2. Guide On-chip clock strategies and GALS
  3. Expert Insight Protecting IP in a collaborative signoff environment

Embedded

  1. Bill Neifert is chief technology officer of Carbon Design Systems. Bill has designed high-performance verification and system integration solutions, and also developed an architecture and coding style for high-performance RTL simulation in C/C++.
    Expert Insight Bringing true power analysis to hardware/software co-design

    While some HW/SW co-design and verification techniques are in place, a power analysis methodology is only just emerging

  2. Article Debugging with virtual prototypes – Part Four
  3. Expert Insight Power management in embedded systems – new thinking required

Briefing

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