A coordinated design methodology fine-tunes chip-to-package PCB layout and routing that involves high-integration devices.
Complexity and the increasing use of thermal analysis software by non-expert designers demands new approaches for chip and PCB implementations.
Electrical rule checks (ERC) are now available to deal with increasing PCB design complexity, speed project delivery and protect the intellectual property within them.
Early use of design for manufacturing can capture PCB yield issues related to pads, copper distribution, same net slivers and more
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