Embedded magnetic RAM is emerging as a contender for on-chip memory not just from a density standpoint but from that of power.
CEA-Leti claimed at IEDM to have achieved major steps in bringing monolithic 3D integration closer to production readiness.
CMOS moving to 3nm and DRAM going beyond 20nm scaling are two of the late papers at the upcoming IEDM and part of a larger examination of semiconductor trends.
IEDM has issued a call for papers for its 2018 conference, expecting to cover devices and circuit interactions in neuromorphic, quantum and conventional computing.
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