December 10, 2012
Mears Technologies and UC Berkeley describe at IEDM 2012 how oxygen in a silicon superlattice could boost performance beyond strained silicon at 14nm.
December 10, 2012
The modelling track at IEDM 2012 showed how germanium could be used in 14nm finFETs. Other work focused on tunnel FETs and analyzing MEMS using Spice.
December 4, 2012
finFETs are vital to the next generation of CMOS processes from Intel, TSMC and others. How will process issues including bulk vs SOI substrates, density limitations, thickness control, and planar device integration affect their practical implementation?
October 15, 2012
Advanced SOI devices with hybrid channel materials may challenge the finFET's future dominance, says IBM
October 11, 2012
Intel finFET family grows to support SoC use, as TSMC boosts p-channel performance with germanium
September 20, 2012
GlobalFoundries has confirmed its 14nm process as the one that will see the foundry introduced finFET-based transistors, claiming that its approach is optimized for mobile devices
August 6, 2012
The president and co-CEO of Synopsys provides his take on the mounting influence of software and physical effects in the creation of SoCs.
June 12, 2012
You want finFETs with different threshold voltages on the same SoC? Forget what the FD-SOI guys tell you: it's possible. At least with a certain amount of performance loss, say IBM and GlobalFoundries.
June 11, 2012
FinFET or trigate structure provide a number of degrees of freedom in design in the battle against DIBL – and one of those dimensions is doping, Professor Tsu-Jae King Liu explained in a course ahead of the 2012 VLSI Symposia this week.
June 4, 2012
What are the chances that FD SOI will become a mainstream process for future nodes?