July 10, 2014
FinScale has developed a design and process recipe for a finFET structure that the company claims is easier to make but which provides better performance than existing approaches.
June 20, 2014
At the VLSI Technology Symposium a team led by STMicroelectronics described the techniques used for the upcoming 14nm FD-SOI to boost speed and density over the 28nm version.
June 2, 2014
Samsung, Synopsys and ARM have been working together to create a finFET design ecosystem.
May 22, 2014
Pulsic has developed an automated mixed-signal layout tool that uses multiple generated variants to let designers pick the best implementation.
April 15, 2014
But some research and process collaboration is set to continue in the background as Samsung, GlobalFoundries and IBM chart their own priorities.
December 16, 2013
Industry-wide innovation is required to make scaling cost-effective at 7nm, says Qualcomm's VP of Technology. Time for a fat, cholesterol and MSG-free diet.
November 20, 2013
FinFETs for 7nm and below processes will be able to integrate high-mobility III-V materials despite being built on silicon processes, thanks to recent work by imec.
November 13, 2013
TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.
October 1, 2013
TSMC 16nm finFET process and efforts to increase p-finFET mobility using germanium to be detailed at December's International Electron Devices Meeting.
July 9, 2013
Xilinx aims to be first of the FPGA makers to produce 20nm devices, expecting to move to production samples for some products by the end of the year.