October 20, 2014
GlobalFoundries is to acquire IBM's fabs in a deal that sees the server maker pay the foundry $1.5bn over five years and agree to exclusivity to 10nm.
September 11, 2014
EUV may be getting most R&D cash but the world's biggest foundry says e-beam currently has the edge on defects and double patterning.
June 13, 2014
Panel discusses Moore's law scaling beyond the 14nm node to 5nm, where economic, device, interconnect, materials, lithography and design issues abound
June 5, 2014
Head of TSMC R&D talks about what it will take to develop and use 10nm, 7nm processes, and a possible shift to using packaging to extend Moore's law scaling
April 7, 2014
The 2013 edition of the International Technology Roadmap for Semiconductors has been published. The latest set of tables underlines the slowdown in some aspects of scaling, particularly when it comes to metal interconnect.
December 16, 2013
Industry-wide innovation is required to make scaling cost-effective at 7nm, says Qualcomm's VP of Technology. Time for a fat, cholesterol and MSG-free diet.
November 13, 2013
TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.
October 4, 2013
Research group CEA-Leti expects to have design kits ready for a 10nm FD-SOI process in June 2014
March 19, 2013
STMicroelectronics pushes on with FDSOI despite dissolution of ST-Ericcson joint venture that provided the lead customer for the process.
December 11, 2012
Can planar devices on fully depleted SOI resist the relentless rise of finFETs as the next device architecture of choice for the semiconductor industry? An evening panel at IEDM explored the trade-offs