With RF, power and MRAM, FD-SOI finds its role
FD-SOI is gradually building up a presence as a technology not just for low-power but RF and power integration.
22nm
GlobalFoundries tunes 28nm for smaller, lower-power FD-SOI
GlobalFoundries has developed variants of the 28nm FD-SOI process that offer smaller die sizes and lower-power operation.
IBM pays GlobalFoundries to take on chipmaking operation
GlobalFoundries is to acquire IBM's fabs in a deal that sees the server maker pay the foundry $1.5bn over five years and agree to exclusivity to 10nm.
Simulations point to better performance for Intel 14nm finFET
Gold Standard Simulations has run simulations to work out how much of an improvement Intel's new rectangular shape represents.
Process development needs hierarchy, abstraction, says tools CTO
How to save money in process development by moving experiments out of the fab and into the computer.
FD-SOI vs finFETs mulled during IEDM
Can planar devices on fully depleted SOI resist the relentless rise of finFETs as the next device architecture of choice for the semiconductor industry? An evening panel at IEDM explored the trade-offs
Semiconductor roadmap gets fuzzier at IEDM
Semiconductor process options outlined at IEDM by Luc van den Hove of imec as industry faces hard choices and rising costs
IPSoC: Tabula aims for 22nm white-label parts
Tabula expects to have 22nm FPGAs next year and is trying to recruit IP developers to an 'app store' for data-center hardware.
FinFETs face planar fightback at IEDM
Advanced SOI devices with hybrid channel materials may challenge the finFET's future dominance, says IBM
IEF: Achronix plans embedded FPGA push
Achronix plans to use the FPGA fabric that it has developed for standalone products to be fabbed through Intel as the springboard for an embedded-FPGA offering.
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