22nm


July 12, 2018

With RF, power and MRAM, FD-SOI finds its role

FD-SOI is gradually building up a presence as a technology not just for low-power but RF and power integration.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , , , ,   |  Organizations: , , ,
July 13, 2015

GlobalFoundries tunes 28nm for smaller, lower-power FD-SOI

GlobalFoundries has developed variants of the 28nm FD-SOI process that offer smaller die sizes and lower-power operation.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations:
October 20, 2014

IBM pays GlobalFoundries to take on chipmaking operation

GlobalFoundries is to acquire IBM's fabs in a deal that sees the server maker pay the foundry $1.5bn over five years and agree to exclusivity to 10nm.
Article  |  Topics: Blog - EDA  |  Tags: , , , , , ,   |  Organizations: ,
August 19, 2014

Simulations point to better performance for Intel 14nm finFET

Gold Standard Simulations has run simulations to work out how much of an improvement Intel's new rectangular shape represents.
Article  |  Topics: Blog - EDA  |  Tags: , , ,   |  Organizations: ,
December 12, 2012

Process development needs hierarchy, abstraction, says tools CTO

How to save money in process development by moving experiments out of the fab and into the computer.
Article  |  Topics: Design to Silicon  |  Tags: , , ,   |  Organizations:
December 11, 2012

FD-SOI vs finFETs mulled during IEDM

Can planar devices on fully depleted SOI resist the relentless rise of finFETs as the next device architecture of choice for the semiconductor industry? An evening panel at IEDM explored the trade-offs
December 11, 2012

Semiconductor roadmap gets fuzzier at IEDM

Semiconductor process options outlined at IEDM by Luc van den Hove of imec as industry faces hard choices and rising costs
December 4, 2012

IPSoC: Tabula aims for 22nm white-label parts

Tabula expects to have 22nm FPGAs next year and is trying to recruit IP developers to an 'app store' for data-center hardware.
Article  |  Topics: Conferences, Blog - EDA  |  Tags: , , , ,   |  Organizations: ,
October 15, 2012

FinFETs face planar fightback at IEDM

Advanced SOI devices with hybrid channel materials may challenge the finFET's future dominance, says IBM
Article  |  Topics: Commentary, Conferences, Blog - EDA  |  Tags: , , , , , ,   |  Organizations: ,
October 4, 2012

IEF: Achronix plans embedded FPGA push

Achronix plans to use the FPGA fabric that it has developed for standalone products to be fabbed through Intel as the springboard for an embedded-FPGA offering.
Article  |  Topics: Conferences, Design to Silicon, Blog - EDA, - General  |  Tags: , , , ,   |  Organizations: , ,

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