The 53rd Design Automation Conference has published its program for the upcoming event in Austin, Texas, which will include keynotes from AMD, nVidia, and NXP Semiconductors and tracks that connect electronics to biology.
According to ARM's Greg Yeric in his keynote at IEDM, even with cost improvements for multiple patterning, fewer designs will see the benefit of further silicon node scaling. Savings will come from design.
A novel approach to 3D NAND will be among the presentations at the International Electron Device Meeting to be held in Washington, DC in December.
Collaboration between ARM, TSMC and Synopsys reveals challenges of 10nm finFET design flows.
Rapid virtual prototyping and a metal stack that's more designer friendly are two of the ways in which Samsung aims to build up foundry market share for its 14nm and 10nm finFET processes.
IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
Is the industry ready to go beyond 10nm when it comes to lithography? Lithography researcher Professor David Pan sees design and process co-operation as the key approach.
Altera has agreed to Intel's offer to buy the company, with FPGAs to be integrated into Xeon processors after 2016. Atoms will join programmable logic in IoT-oriented devices.
As plans crystallize to take FD-SOI down to 10nm, CEA-Leti argues that the technology can provide an alternative path to that of finFETs to get to 7nm processes and beyond.
Process development alliance will enable Imec to experiment on 10 and 7nm processes in the computer before moving to the fab
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