IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
EUV may be getting most R&D cash but the world's biggest foundry says e-beam currently has the edge on defects and double patterning.
The semiconductor industry is reaching a crunch point at which companies that form it have to work together much more closely, says Malcolm Penn of Future Horizons.
TSMC follows Intel in taking a stake in ASML to accelerate development of EUV and 450mm lithography equipment.
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