IBM and friends at 7nm: breakthrough or science project?
IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
ASML
TSMC: e-beam winning on cost over EUV for lithography
EUV may be getting most R&D cash but the world's biggest foundry says e-beam currently has the edge on defects and double patterning.
IEF: “Industry will have to cooperate”
The semiconductor industry is reaching a crunch point at which companies that form it have to work together much more closely, says Malcolm Penn of Future Horizons.
TSMC joins Intel as ASML investor to accelerate availability of EUV, 450mm lithography
TSMC follows Intel in taking a stake in ASML to accelerate development of EUV and 450mm lithography equipment.
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