Semicon Taiwan


July 9, 2015

IBM and friends at 7nm: breakthrough or science project?

IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.
September 11, 2014

TSMC: e-beam winning on cost over EUV for lithography

EUV may be getting most R&D cash but the world's biggest foundry says e-beam currently has the edge on defects and double patterning.
Article  |  Topics: Design to Silicon, Blog - EDA  |  Tags: , , , , , , ,   |  Organizations: , , ,
September 10, 2014

Foxconn’s wishlist for wearables and the Internet of Things

Manufacturing giant says we need a new category of WPUs - wearables processing units - to create a mass market and that ARM needs to go smaller than the MO.

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