Semicon Taiwan

July 9, 2015

IBM and friends at 7nm: breakthrough or science project?

IBM, GlobalFoundries, Samsung and SUNY deserve kudos for manufacturing the first 7nm chip but the NREs involved still look frightening.

Article | Topics: Commentary, Design to Silicon, Blog - EDA | Tags: 10nm, 7nm, EUV, multi patterning, silicon germanium | Organizations: Applied Materials, ASML, GlobalFoundries, IBM, IEDM, Samsung Electronics, Semicon Taiwan, SUNY Albany, TSMC

September 11, 2014

TSMC: e-beam winning on cost over EUV for lithography

EUV may be getting most R&D cash but the world's biggest foundry says e-beam currently has the edge on defects and double patterning.

Article | Topics: Design to Silicon, Blog - EDA | Tags: 10nm, 7nm, double patterning, e-beam, EUV, foundry, immersion lithography, mask | Organizations: ASML, IMEC, Semicon Taiwan, TSMC

September 10, 2014

Foxconn’s wishlist for wearables and the Internet of Things

Manufacturing giant says we need a new category of WPUs - wearables processing units - to create a mass market and that ARM needs to go smaller than the MO.

Article | Topics: Conferences, Blog - EDA, Embedded | Tags: 64bit, 8051, Android, Arm Cortex-M, cloud computing, HTML5, internet of things, low power, MIPS, OS, sensors, Tizen, wearables | Organizations: Apple, Arm, Foxconn, Google, Imagination Technologes, Samsung Electronics, Semicon Taiwan

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