14nm/16nm

June 20, 2018

SAR-VCO combo tunes RF receiver power on 16nm

Researchers from the UC Berkeley and Intel teamed up to develop an energy-tuneable RF front-end on a digital finFET process with no need for analog process options.
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May 29, 2017

ARM extends top end of Cortex-A family

A year on from the last Computex and the launch of the Cortex-A73 and Mali-G71, ARM has launched a new trio of processors aimed not just at smartphones this time but servers and driver-assistance systems.
May 19, 2017

FinFET-project growth ‘stunning’ says EDA exec

Machine learning, smarter cars, and the infrastructure to support a sixfold increase in IoT and edge devices have helped push up the number of teams doing finFET designs to more than 100, according to Tom Beckley of Cadence.
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June 6, 2016

Menta launches fourth-generation embedded FPGA core

Menta SAS has launched an embedded FPGA core family that improves density over previous versions.
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February 2, 2016

Cadence boosts compression with physical DFT tool

Cadence has use physically aware placement in a test tool that promises less routing congestion for scan test and which increases the potential for stimulus compression.
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July 28, 2015

Samsung applies early prediction and color management to 10nm plans

Rapid virtual prototyping and a metal stack that's more designer friendly are two of the ways in which Samsung aims to build up foundry market share for its 14nm and 10nm finFET processes.
June 16, 2015

Collaboration let HiSilicon accelerate 16nm finFET plans

HiSilicon claims close collaboration with foundry and EDA tools partners helped speed up plans to tape out the first 16nm finFET-based design through TSMC.
June 3, 2015

Cadence deploys parallel strategy for faster synthesis

RTL synthesis has joined the array of tools developed by Cadence Design Systems that employ distributed processing, with the aim of exploring more ways of creating area- and power-efficient logic blocks.
March 11, 2015

IoT and RF ‘to drive FD-SOI adoption’

The FD-SOI technology developed by CEA-Leti and STMicroelectronics is beginning to gain ground as chipmakers investigate the process as a way to deliver low-energy, wireless-capable SoCs.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , , ,   |  Organizations: , ,
March 11, 2015

Charting out the roadmap for FD-SOI

As plans crystallize to take FD-SOI down to 10nm, CEA-Leti argues that the technology can provide an alternative path to that of finFETs to get to 7nm processes and beyond.
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