Tech Design Forum
Briefing
e-beam
e-beam
September 11, 2014
TSMC: e-beam winning on cost over EUV for lithography
EUV may be getting most R&D cash but the world's biggest foundry says e-beam currently has the edge on defects and double patterning.
Article | Topics:
Design to Silicon
,
Blog - EDA
| Tags:
10nm
,
7nm
,
double patterning
,
e-beam
,
EUV
,
foundry
,
immersion lithography
,
mask
| Organizations:
ASML
,
IMEC
,
Semicon Taiwan
,
TSMC
May 22, 2013
Gartner: Multi-patterning here to stay, EUV lithography still 50:50
Plan around 193nm immersion lithography. Alternatives are years off and not guaranteed, says analyst group
Article | Topics:
Design to Silicon
,
Blog - EDA
| Tags:
directed self-assembly
,
double patterning
,
e-beam
,
EUV
,
immersion lithography
| Organizations:
Gartner
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