IEDM 2015


December 11, 2015

IEDM keynote: cost scaling will swap architectural changes for area

According to ARM's Greg Yeric in his keynote at IEDM, even with cost improvements for multiple patterning, fewer designs will see the benefit of further silicon node scaling. Savings will come from design.
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September 30, 2015

Vertical structures to debut at IEDM 2015

A novel approach to 3D NAND will be among the presentations at the International Electron Device Meeting to be held in Washington, DC in December.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , , ,   |  Organizations:

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