Mentor buys BDA for AMS portfolio
Mentor Graphics has bought Berkeley Design Automation (BDA), a specialist in analog, mixed-signal, and RF circuit verification using FastSpice.
Author Archives: Paul Dempsey
Mentor begins to take wraps off Xpedition PCB software overhaul
New-look Xpedition flow launches with preview of layout features including better control over automation, 2D/3D views, and a UI even for 'casual' users.
Synopsys targets 5X performance gain with integrated verification suite
New tool technologies, Verdi integration and greater flow concurrency also contribute to a claimed 3X increase in productivity for Verification Compiler.
Cadence to buy Forte and build out HLS offering
EDA giant cites high-level synthesis' move into the mainstream as driven by IP integration challenges in striking deal for the HLS market leader.
TSMC hints at glass interposer for mobile SoCs
Glass may be the high frequency interposer option given silicon concerns about power and noise. TSMC adds another pathfinder to its 3D arsenal.
Qualcomm’s take on preserving Moore’s Law economics
Industry-wide innovation is required to make scaling cost-effective at 7nm, says Qualcomm's VP of Technology. Time for a fat, cholesterol and MSG-free diet.
Graphene gets a reality check
A leading researcher argues that graphene will not replace but complement silicon and thrive in specialist applications.
TSMC succession plan emphasizes stability
TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.
TSMC demonstrates readiness for 3D-IC
Research projects to verify methodologies, address third-party integration challenges and add a low-cost interposer-like technology to the 3D-IC family make their mark.
Rambus CEO calls for collaboration and an architectural focus for memory
Dr Ron Black also discussed his experiences with the Internet of Things in a lively keynote at the GSA Memory+ Conference in Taipei