About Paul Dempsey
Paul Dempsey is editor-in-chief of Tech Design Forum and has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
March 24, 2015
Flow draws on existing strengths in Xpedition, Valor, Nimbic and Flotherm among others to optimize 3D design projects and improve cross-disciplinary communication.
March 17, 2015
Foundry veteran Simon Yang told Semicon China while things are looking up the country cannot count on ‘traditional’ methods or advantages if it's to be a major chipmaker.
March 17, 2015
Comms giant to seek out more local partnerships with China poised to account for a third of car sales with each new vehicle featuring 1,000 semis.
March 10, 2015
'Bling' for fashionistas and the B Ark lot. Apple Watch limps as the S1 SIP fails to offer convincing battery life. Silicon shortfall still dogs wearables.
February 25, 2015
Ascent Lint adds checks for DO-254, tighter integration with HDL Coder, more SystemVerilog support and new VHDL and Verilog rules in March update.
February 16, 2015
The $99 discount registration price for Cadence's main US user conference will no longer be available after Friday (February 20)
February 9, 2015
New portfolio integrates and extends existing industrial embedded tools to meet the demands of Industry 4.0
December 18, 2014
The leading EDA analyst also charts growth for RTL and IC CAD in 2014 Market Share Summary, and highlights system-driven shifts in tool evaluation.
November 12, 2014
Not just Intel and TI but also Lenovo and Huawei have cause to welcome end to 25% import tax. And could it even help reinvigorate Chinese start ups?
November 4, 2014
Are we torn between evolution and revolution? Mentor Graphics' Joe Sawicki discusses how pattern matching already in fabs could move up and radically alter the design flow.