About Paul Dempsey
Paul Dempsey is editor-in-chief of Tech Design Forum and has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
January 31, 2023
As first silicon success declines, new software aims to provide a more holistic view of coverage data from multiple sources.
December 1, 2022
The key to exploiting AI is being clear about where its family of technologies can help to improve and democratize design.
September 27, 2022
Tessent Multi-die extends the capabilities of the DFT suite in line with new standards intended to enable widespread adoption of interposer and stacked die strategies.
August 18, 2021
A DVCon technical paper addresses potential reset domain crossing metastability issues due to UPF instrumentation.
May 19, 2021
The avionics design assurance guidance has its own flavor of verification which needs to be understood alongside its definition of validation.
May 13, 2021
Latest acquisition adds technologies to mitigate rising verification time and cost for third-party IP.
April 19, 2021
Siemens's expansion of the Veloce hardware-assisted verification platform delivers on one of its current mission statements.
April 16, 2021
The formal apps start-up has built strong positions in automotive and RISC-V and will strengthen Siemens in competition with Cadence.
February 26, 2021
Following its rebranding from Mentor, the division will have a strong presence in the main program and across virtual roundtables at next week's online event.
December 4, 2020
Study may point to new challenges in more bidirectional AMS implementations on SoC-class designs, though formal and emulation help keep respin count in check.