Amkor keeps question mark next to ‘full’ 3D-IC in 2016
Stacked 3D-IC memory-on-logic is on the packaging company's roadmap, but there are still yield hurdles to scale at the MEOL.
Author Archives: Paul Dempsey
Mentor targets PCB ERP ‘missing link’
Valor additions aim to deliver shopfloor data to PCB ERP systems in real time... for the first time. And could boost ROI beyond 70%.
DAC 2014 aims to build design bridge to automotive
DAC to link chip, software and system design to automotive OEMs with a new track covering 21 topics within four themes. Call for abstracts now open.
Latest Nucleus RTOS offers secure memory partitioning for mid-market design
Mentor's new version of its RTOS targets once high-cost flexibility with secure and reliable in-operation upgrades and app swap-outs for medical, industrial and smart energy.
3D-IC focus for GSA’s Taipei Memory+ event next week
Packed one-day event has speakers from Cadence, TSMC, Samsung, Amkor, Advantest and more providing a senior level view of making 3D-IC a reality. Registration closes soon.
India outlines subsidies for foundry fab plan
The Indian government will meet up to a quarter of initial capital costs for a foundry capable of nodes up to 45nm and 40,000 wafer starts per month at 300mm.
Verification Futures rolls out in Europe next month
The one-day conference series features the latest innovations from many verification vendors in separate UK, France and Germany editions.
Help preserve EDA’s slice of electronics history
There's still time - just - to reserve your place at EDAC's Back To the Future dinner and auction to raise funds to mark EDA's contribution to our business at the Computer History Museum.
Jasper preps User Group and Architectural events
The EDA vendor has set a broad agenda across two Silicon Valley events taking place in late October, with registration now open for both.
Real Intent CEO Prakash Narain on moving from RTL to SoC sign-off
Prakash Narain of Real Intent on SoC sign-off, static verification, interoperability, predictability, ROI and more.