Author Archives: Paul Dempsey

About Paul Dempsey

Paul Dempsey is editor-in-chief of Tech Design Forum and has been a technology journalist for 20 years. His work has also appeared in EETimes, Red Herring and specialist journals published by the Financial Times.
May 21, 2014

Verification perspectives 2: formal for the masses and graph-based techniques

The second part of our interview with Mark Olen and Jim Kenney, looks at how formal and graph-based techniques move the market beyond simulation.
May 13, 2014

Mentor targets 10X cut in reliability test for power electronics

New MicReD power tester identifies failure causes without the need for post-test lab analysis
April 28, 2014

Synopsys speeds HAPS prototyping with ProtoCompiler

HAPS-specific enhancements to Synplify and Certify join next gen partitioning and planning in suite that claims 3X boost in time-to-prototype
Article  |  Topics: Blog Topics, RTL, Verification  |  Tags: , , , ,   |  Organizations:
April 16, 2014

Verification perspectives: the growth of emulation

The first in a series of articles on how various vendors are addressing the flow's most challenging task looks at Mentor's strategy for emulation.
April 15, 2014

Common Platform foundry alliance to be wound down

But some research and process collaboration is set to continue in the background as Samsung, GlobalFoundries and IBM chart their own priorities.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: , , ,
April 10, 2014

Mentor builds simulation-emulation bridge to ‘Verification 3.0’

Enterprise Verification Platform adds cross-over SystemVerilog, UVM, and UPF support for Veloce alongside new hardware and software debuggers.
April 3, 2014

Mentor’s User2User Silicon Valley conference this week

Registration is free-of-charge to attend Mentor, Oracle and Samsung keynotes and choose from nine technical tracks at one-day event.
Article  |  Topics: Blog Topics, Conferences, Blog - EDA, PCB  |  Tags: , ,   |  Organizations:
March 27, 2014

Intel and Altera extend foundry deal into interposer and full 3D

Deal quashes rumors that Altera was about to move its cutting edge production back to TSMC, but nor does it appear to be 'exclusive' for 3D products.
Article  |  Topics: Design to Silicon, Blog - EDA  |  Tags: , , , , ,   |  Organizations: , ,
March 27, 2014

Mentor’s Valor tightens PCB design-to-manufacture links

Valor NPI-based flow claims first in automating the passage of drawings to fabrication, and enabling dynamic DFM feedback from manufacturers.
Article  |  Topics: Blog Topics, Blog - PCB  |  Tags: , , , ,   |  Organizations:
March 26, 2014

Real Intent’s Ascent XV at the ‘fuzzy’ boundary between design and verificiation

Upgrade to Ascent XV X-propagation and reset optimization tool claims 10X runtime gain, deeper reporting, further integration with Verdi and more.
Article  |  Topics: Blog - EDA, - Verification  |  Tags: , , , , ,   |  Organizations: ,