mobile

Strato emulator family adds modular boxes that can build from 640K and 1.25B gate-counts for automotive, mil/aero markets and 'digital twin' strategies.

A year on from the last Computex and the launch of the Cortex-A73 and Mali-G71, ARM has launched a new trio of processors aimed not just at smartphones this time but servers and driver-assistance systems.

HiSilicon claims close collaboration with foundry and EDA tools partners helped speed up plans to tape out the first 16nm finFET-based design through TSMC.

By widening the range of resources that can be tracked within an SoC, Ultrasoc says it has uncovered ways to make debug a long-term tool for complex multicore designs.

Glass may be the high frequency interposer option given silicon concerns about power and noise. TSMC adds another pathfinder to its 3D arsenal.

To get others to adopt its GPU cores, Nvidia must quickly build partnerships with tool vendors and foundries that guarantee easy implementation.

Graphics chipmaker nVidia has said it plans to license as IP cores some of its technology in the hope of building up a customer base among other chipmakers and systems houses developing their own SoCs.

Cadence-and-Synopsys co-founder and Freescale's new CEO join the DAC 2013 program, while Qualcomm and TI line up to discuss their work in mobile comms as well as taking your questions.

Our first email newsletter previews next month's Common Platform Technology Forum 2012 and features exclusive interviews with senior staff at Samsung, ARM and Cadence Design Systems.

The high peak to average power ratios of LTE signals pose a power challenge to handset designers. Envelope tracking may help ease the problem.