Go inside proposals for common chiplet models
Chiplets will need models to guarantee heterogenous SiP implementation. A cross-industry working group describes its progress so far.
ecosystem
Microsemi sets up RISC-V partner program
Microsemi has set up an ecosystem program around the RISC-V soft cores the company has designed for its FPGAs.
The return of the CEO Outlook
The ESD Alliance is relaunching the annual panel session featuring CEOs from ARM, Cadence Design Systems, Mentor Graphics and Synopsys in Mountain View on April 9.
Collaboration let HiSilicon accelerate 16nm finFET plans
HiSilicon claims close collaboration with foundry and EDA tools partners helped speed up plans to tape out the first 16nm finFET-based design through TSMC.
Qualcomm takes 28nm to China in SMIC deal
Chinese foundry Semiconductor Manufacturing International Corporation (SMIC) is to get a helping hand to develop a production-class 28nm process from Qualcomm Technologies.
Common Platform foundry alliance to be wound down
But some research and process collaboration is set to continue in the background as Samsung, GlobalFoundries and IBM chart their own priorities.
Conference demonstrator brings printed-electronics suppliers together
For its Printed Electronics conference, IDTechEx pulled together a team together with P&G to develop a collaborative demonstration of the technology.
NXP captures tools for ARM micros with Code Red buy
NXP Semiconductors has decided to buy tools supplier Code Red Technologies to help build up software support for its ARM-based microcontrollers.
IEF: “Industry will have to cooperate”
The semiconductor industry is reaching a crunch point at which companies that form it have to work together much more closely, says Malcolm Penn of Future Horizons.
Technical Newsletter #1: Common Platform, Samsung, ARM, Cadence
Our first email newsletter previews next month's Common Platform Technology Forum 2012 and features exclusive interviews with senior staff at Samsung, ARM and Cadence Design Systems.