2.5DIC

June 1, 2023

Does 2.5DIC call for IC design tools for the packaging?

Siemens has published a white paper that examines whether package designers need to adopt IC tools and design styles in the move from organic packages to 2.5DIC packages.
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January 4, 2023

A*Star lays out SiP applications choices at IEDM

The choices for heterogeneous integration are falling into three main families, demonstrated by A*Star at IEDM 2022.
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September 21, 2022

Nvidia proposes split-level link for chiplet interconnect

Nvidia revealed at its Fall GTC work the company has done on a bidirectional energy-saving chiplet interconnect that could hit the equivalent of 50Gbit/s per line.
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July 28, 2021

Automate latchup verification for 3DIC

A Siemens white paper describes a way of automatically deriving information from 2.5D/3DIC designs to streamline latchup design-rules verification.
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July 15, 2021

Chiplets to need digital twins for reliability

The added complexity of managing reliability as chiplet-based designs become more common will need to be managed using digital-twin techniques, says a professor working in the field.
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July 13, 2020

Heterogeneous integration calls for new approaches

Heterogeneous integration has the potential to overcome the yield and cost challenges presented by the growing headwinds associated with process scaling. But it may take a dramatic rethink in design approaches.
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July 8, 2020

Scaling costs tip balance toward chiplets for AMD server processors

In a panel session at VLSI Symposia, AMD described how the economics have come down strongly in favor of multichip integration for multicore server processors.
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June 20, 2018

DAC 2018 preview: Mentor

Mentor will be present throughout the DAC program but with a particular focus on machine learning, artificial intelligence and automotive challenges.
June 5, 2017

Mentor builds links for multichip package integration

Mentor, a Siemens business, has formed an alliance with foundries and OSAT providers and launched a flow that brings IC and package design together.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , , , , , ,   |  Organizations: ,
January 9, 2017

VLSI Symposia issue calls for papers

Online paper submissions are now open for the 2017 Symposia on VLSI Technology and Circuits.
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