June 20, 2022
Intel expects to double logic density through metal scaling and smaller cells with upcoming process.
March 23, 2022
Nvidia says it will support the UCIe chiplet interface standard once it has "stabilized" while opening up its latest form of NVLink to other companies.
March 18, 2019
The ODSA Workgroup formed by Netronome and others is looking to adopt the PIPE standard for interconnecting chiplets as it starts work on a proof-of-concept module.
June 5, 2017
Mentor, a Siemens business, has formed an alliance with foundries and OSAT providers and launched a flow that brings IC and package design together.
April 13, 2016
Companies presenting at User2User Santa Clara on April 26 include AMD, Microsoft, nVidia, Oracle, Qualcomm, and Samsung.