PCI may provide key to OCP chiplet standard
The ODSA Workgroup formed by Netronome and others is looking to adopt the PIPE standard for interconnecting chiplets as it starts work on a proof-of-concept module.
multi-die package
Mentor builds links for multichip package integration
Mentor, a Siemens business, has formed an alliance with foundries and OSAT providers and launched a flow that brings IC and package design together.
User2User preview: Silicon Valley edition rolls out this month
Companies presenting at User2User Santa Clara on April 26 include AMD, Microsoft, nVidia, Oracle, Qualcomm, and Samsung.
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