Siemens has agreed to acquire UK-based debug and on-chip instrumentation startup UltraSoC and will fold the operation into Mentor’s Tessent test-software product line.
Moortec has reworked its thermal-sensing core design to allow for finer-grained use on SoCs being designed for the 5nm node.
Papers presented at the recent IRPS conference showed the growing importance of lifetime monitoring to the problem of handling components as they age.
Keynotes at this year’s IRPS conference focused on the way in which scaling is forcing changes to the way that the reliability aspects of semiconductors are examined.
Traditional approaches to via insertion to meet reliability and yield at advanced nodes are giving way to necessary automation.
Cadence has started the rollout of a set of design tools for mixed-signal reliability analysis.
As geometries have shrunk, layout-dependent effects in CMOS have become ever more problematic. They are not just popping up in performance but reliability and aging effects as one IEDM presentation showed.
A look at some of trade-offs involved in building large system memories for enterprise equipment using DDR4 IP.
Videos detail techniques to improve the functional safety and reliability of FPGA designs, including the implementation of triple modular redundancy, safe FSM schemes and self monitoring.
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