Cadence Design Systems has introduced a platform for performing thermal and thermal-stress analysis of subsystems, from 2.5D and 3DICs to PCBs and complete electronic assemblies.
The company said its acquisition of UK-based Future Facilities in 2022 provided the core of the new Celsius Studio, which provides support for linked electrical and mechanical CAD and design optimisation assisted by artificial intelligence (AI). Offering support for multi-stage analysis, the can be used to track expected changes during assembly process to help address 3DIC warpage issues.
According to Cadence, by offering differing levels of granularity, the tool is able to model small structures such as individual packages at the same time as the chassis inside which it will sit in the target system. Part of this comes from combining finite element method (FEM) with other methods from computational fluid dynamics (CFD) to let the analysis adapt to chip and system-level conditions.
Ben Gu, corporate vice president of R&D for multiphysics system analysis at Cadence, claimed, “Seamless integration with Cadence’s powerful implementation platforms empowers our customers to perform multiphysics in-design analysis for chips, packages and boards all the way through to complete systems.”