Harness manufacture in automotive remains manually intensive but model-based engineering provides a way to streamline the processes to make them more efficient, a Mentor white paper claims.
Cooperation in key verticals such as automotive and changes for DAC as well as global conference outreach underpin EDA association's move.
What's old is new: 200mm wafers are returning and driving shortages while 450mm fades into the distance.
Cadence has launched the 16.6 release of its Allegro PCB-design portfolio, adding modules for manufacturing documentation and design-rule preparation aids.
How to save money in process development by moving experiments out of the fab and into the computer.
Guest blogger Jeff Wilson discusses some of the subtleties involved in the effective use of dummy fill in deep sub-micron IC designs.
Ever increasing lithography challenges mean the next generation of design rules may concentrate on telling you just what you can rather than what you cannot do.
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