manufacturing


April 6, 2021

Siemens cloud tool streamlines DFM for PCBs

Siemens has introduced a cloud-based DFM tool intended to bridge the gap between the electronics design and manufacturing.
Article  |  Topics: Blog - PCB  |  Tags: , , , ,   |  Organizations:
February 17, 2021

DAC and Semicon West move to December

Both Semicon West and DAC have been moved to December in anticipation of travel restrictions being much looser by then, with both events working on a hybrid physical and online format.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,
September 23, 2019

Automating wire-harness development

Harness manufacture in automotive remains manually intensive but model-based engineering provides a way to streamline the processes to make them more efficient, a Mentor white paper claims.
Article  |  Topics: Blog - Electrical Design, PCB  |  Tags: , , ,   |  Organizations:
April 20, 2018

SEMI-ESDA tie-up aims to extend EDA’s global reach

Cooperation in key verticals such as automotive and changes for DAC as well as global conference outreach underpin EDA association's move.
January 18, 2017

Wafer expansion hits the buffers

What's old is new: 200mm wafers are returning and driving shortages while 450mm fades into the distance.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: ,
May 24, 2015

Cadence updates Allegro with PCB production and routing tools

Cadence has launched the 16.6 release of its Allegro PCB-design portfolio, adding modules for manufacturing documentation and design-rule preparation aids.
Article  |  Topics: Blog - PCB  |  Tags: , , , , ,   |  Organizations:
December 12, 2012

Process development needs hierarchy, abstraction, says tools CTO

How to save money in process development by moving experiments out of the fab and into the computer.
Article  |  Topics: Design to Silicon  |  Tags: , , ,   |  Organizations:
May 22, 2012

Making dummy fill smarter

Guest blogger Jeff Wilson discusses some of the subtleties involved in the effective use of dummy fill in deep sub-micron IC designs.
Article  |  Topics: Commentary, Design to Silicon, Blog - EDA, - Industry Blogs  |  Tags: , ,   |  Organizations:
March 15, 2012

CPTF notebook: From restricted to ‘proscriptive’ design rules

Ever increasing lithography challenges mean the next generation of design rules may concentrate on telling you just what you can rather than what you cannot do.

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