Design to Silicon

December 12, 2012

Process development needs hierarchy, abstraction, says tools CTO

How to save money in process development by moving experiments out of the fab and into the computer.
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December 11, 2012

FD-SOI vs finFETs mulled during IEDM

Can planar devices on fully depleted SOI resist the relentless rise of finFETs as the next device architecture of choice for the semiconductor industry? An evening panel at IEDM explored the trade-offs
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December 11, 2012

Semiconductor roadmap gets fuzzier at IEDM

Semiconductor process options outlined at IEDM by Luc van den Hove of imec as industry faces hard choices and rising costs
October 26, 2012

Mentor Graphics CEO Wally Rhines – Interview

The Mentor chief discusses ESL-based low power, emulation, 32nm to 20nm and using tools in the cloud.
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October 11, 2012

The physical design challenges of 20nm processes

Manufacturability, routing, library design and more - it all needs rethinking at 20nm
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October 9, 2012

TSMC updates reference flows for 20nm and CoWoS

TSMC has released two reference flows – one for its 20nm and the other for the form of 3D integration favored by the Taiwanese foundry, chip on wafer on substrate (CoWoS).


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October 9, 2012

Event alert: TSMC Open Innovation Platform

With the foundry giant set to take the wraps off its latest flows and innovations in just seven days, remember that you must pre-register to attend its Silicon Valley event. Also here are some pre-event pointers.
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October 5, 2012

IEF: Process kits for processes that don’t yet exist

Designers should plan ahead for future process changes as conventional silicon CMOS runs out of steam, IMEC's Rudy Lauwereins told delegates at the International Electronics Forum in Bratislava this week.
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October 4, 2012

IEF: “Industry will have to cooperate”

The semiconductor industry is reaching a crunch point at which companies that form it have to work together much more closely, says Malcolm Penn of Future Horizons.
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October 4, 2012

IEF: Achronix plans embedded FPGA push

Achronix plans to use the FPGA fabric that it has developed for standalone products to be fabbed through Intel as the springboard for an embedded-FPGA offering.
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