Flexible hybrid electronics: Making an emerging tech happen with PDKs and reference designs
FHE use-cases are evolving and the NextFlex consortium is looking to smooth their path with a strategy, PDKs and reference modules.
reference flow
EDA and IP vendors roll out support for TSMC’s 20nm, 3DIC processes
IP and EDA vendors line up to support TSMC 20nm process, CoWoS 3DIC technology
TSMC updates reference flows for 20nm and CoWoS
TSMC has released two reference flows – one for its 20nm and the other for the form of 3D integration favored by the Taiwanese foundry, chip on wafer on substrate (CoWoS).
PLATINUM SPONSORS
View All Sponsors