EDA

March 18, 2024

Arteris extends safety and speed for NoC

Certification to ISO 26262 for automotive systems and compatibility with the latest Arm9 generation of processors and the CHI-E interface are among the updates to Arteris’ Ncore cache-coherent on-chip network IP framework.
Article  |  Topics: Blog - IP  |  Tags: , , , , , ,   |  Organizations:
March 14, 2024

Two projects to deliver digital twins for software-defined vehicles

Arm is working with Cadence and Siemens on separate projects to support its plans in the SDV space.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , , ,   |  Organizations: , ,
February 22, 2024

Cadence to work on IP for Intel 18A

Cadence has agreed to work with Intel Foundry Services on IP and flows for the 18A process, which will include backside power delivery and nanosheet transistors.
Article  |  Topics: Blog - EDA, IP  |  Tags: , , ,   |  Organizations: ,
February 1, 2024

Future Facilities core drives Cadence thermal suite

Cadence has introduced a platform for performing thermal and thermal-stress analysis of subsystems, from 2.5D and 3DICs to PCBs and complete electronic assemblies.
Article  |  Topics: Blog - EDA, PCB  |  Tags: , , ,   |  Organizations:
January 21, 2024

Take a deeper dive into BCI-ROM

A new paper looks at examples for using The Boundary Condition Independent Reduced Order Model (BCI-ROM) in its VHDL-AMS implementation for electro-thermal analysis.
Article  |  Topics: Digital/analog implementation, Standards, Verification  |  Tags: , , , ,   |  Organizations:
December 5, 2023

Zero ASIC open sources system simulation/emulation platform

Start-up launches platform on path to the specification, emulation and simulation of large chiplet-based designs.
December 4, 2023

EMA spins off IP, content and services activities

EMA Design Automation to launch sister company, Accelerated Designs, to help clients streamline processes, cut manual effort, and connect data.
Article  |  Topics: Blog - EDA, IP  |  Tags: ,   |  Organizations:
November 30, 2023

Benchmarking the maturity of AI in EDA

Solido discusses how it has leveraged AI for SPICE level efficiency and the benchmarks it has used.
November 20, 2023

ETRI builds flow for AI chiplets

South Korea's leading research institute has built a reusable flow for lower power petaflops-performance AI.
Article  |  Topics: Blog - EDA, - HPC, Next Generation Design, Packaging, Verification  |  Tags: , , ,   |  Organizations: , ,
November 17, 2023

Siemens takes automotive digital twin to the AWS cloud

Siemens has made its PAVE360 automotive digital-twin software available on AWS, with the ability to access fast Arm models on the same cloud.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , , ,   |  Organizations: , ,

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