Design to Silicon

June 2, 2014

Samsung certifies Synopsys tools, IP at 14nm

Samsung, Synopsys and ARM have been working together to create a finFET design ecosystem.
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June 2, 2014

Mentor’s Wally Rhines on tools as a cultural issue

Whether you're going to DAC this week or not, it's worth remembering one of the other key factors that will inform your judgments on new tools.
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March 27, 2014

Intel and Altera extend foundry deal into interposer and full 3D

Deal quashes rumors that Altera was about to move its cutting edge production back to TSMC, but nor does it appear to be 'exclusive' for 3D products.
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December 16, 2013

TSMC hints at glass interposer for mobile SoCs

Glass may be the high frequency interposer option given silicon concerns about power and noise. TSMC adds another pathfinder to its 3D arsenal.
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December 16, 2013

Qualcomm’s take on preserving Moore’s Law economics

Industry-wide innovation is required to make scaling cost-effective at 7nm, says Qualcomm's VP of Technology. Time for a fat, cholesterol and MSG-free diet.
November 20, 2013

FinFETs’ III-V future promises sub-7nm, RF and opto CMOS

FinFETs for 7nm and below processes will be able to integrate high-mobility III-V materials despite being built on silicon processes, thanks to recent work by imec.
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November 13, 2013

TSMC succession plan emphasizes stability

TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.
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November 7, 2013

TSMC demonstrates readiness for 3D-IC

Research projects to verify methodologies, address third-party integration challenges and add a low-cost interposer-like technology to the 3D-IC family make their mark.
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November 4, 2013

Amkor keeps question mark next to ‘full’ 3D-IC in 2016

Stacked 3D-IC memory-on-logic is on the packaging company's roadmap, but there are still yield hurdles to scale at the MEOL.
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October 23, 2013

3D-IC focus for GSA’s Taipei Memory+ event next week

Packed one-day event has speakers from Cadence, TSMC, Samsung, Amkor, Advantest and more providing a senior level view of making 3D-IC a reality. Registration closes soon.

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