EDA

A panel at DVCon argued too much of a focus on point tools coupled with challenges with interoperability and cross-industry cooperation is hindering the ability of SoC teams to design and verify complex products.

Synopsys R&D vice president Manish Pandey described the ways in which the tools supplier has harnessed machine learning so far to gain speedups and improvements in coverage.

Learn how to ingest data from multiple engineering teams in multiple formats on interposer and other multi-dimensional projects.

System Technology Co-optimization raises various SI, PI, thermal, mechanical and warp risks due to its use of advanced packaging. Early-stage prototyping mitigates them.

Silicon Photonics 3D integration posed LVS challenges in this fast emerging technical space. A case study describes how the two institutions overcame them.

Advanced packaging requirements from foundries and OSATs pose stringent challenges. A new paper describes three ways of satisfying them.

Siemens software will be used to accelerated the development of commercial aircraft.

Siemens has refreshed its collaboration with PDF Solutions with the aim of using test data and other sources to provide actionable information to improve device yield.

FHE use-cases are evolving and the NextFlex consortium is looking to smooth their path with a strategy, PDKs and reference modules.

Imperas has put together a suite of tools to verify that custom RISC-V processor cores remain compatible with the common infrastructure behind the open-source instruction set.