EDA

Cadence has agreed to work with Intel Foundry Services on IP and flows for the 18A process, which will include backside power delivery and nanosheet transistors.

Cadence has introduced a platform for performing thermal and thermal-stress analysis of subsystems, from 2.5D and 3DICs to PCBs and complete electronic assemblies.

A new paper looks at examples for using The Boundary Condition Independent Reduced Order Model (BCI-ROM) in its VHDL-AMS implementation for electro-thermal analysis.

Start-up launches platform on path to the specification, emulation and simulation of large chiplet-based designs.

EMA Design Automation to launch sister company, Accelerated Designs, to help clients streamline processes, cut manual effort, and connect data.

Solido discusses how it has leveraged AI for SPICE level efficiency and the benchmarks it has used.

South Korea's leading research institute has built a reusable flow for lower power petaflops-performance AI.

Siemens has made its PAVE360 automotive digital-twin software available on AWS, with the ability to access fast Arm models on the same cloud.

Cadence and Autodesk have linked their respective cloud-based PCB and mechanical design tools.

Siemens has completed the acquisition of Insight EDA, a specialist in circuit-reliability analysis.