February 22, 2024
Cadence has agreed to work with Intel Foundry Services on IP and flows for the 18A process, which will include backside power delivery and nanosheet transistors.
February 1, 2024
Cadence has introduced a platform for performing thermal and thermal-stress analysis of subsystems, from 2.5D and 3DICs to PCBs and complete electronic assemblies.
January 21, 2024
A new paper looks at examples for using The Boundary Condition Independent Reduced Order Model (BCI-ROM) in its VHDL-AMS implementation for electro-thermal analysis.
December 5, 2023
Start-up launches platform on path to the specification, emulation and simulation of large chiplet-based designs.
December 4, 2023
EMA Design Automation to launch sister company, Accelerated Designs, to help clients streamline processes, cut manual effort, and connect data.
November 30, 2023
Solido discusses how it has leveraged AI for SPICE level efficiency and the benchmarks it has used.
November 20, 2023
South Korea's leading research institute has built a reusable flow for lower power petaflops-performance AI.
November 17, 2023
Siemens has made its PAVE360 automotive digital-twin software available on AWS, with the ability to access fast Arm models on the same cloud.
November 16, 2023
Cadence and Autodesk have linked their respective cloud-based PCB and mechanical design tools.
November 15, 2023
Siemens has completed the acquisition of Insight EDA, a specialist in circuit-reliability analysis.