Scaling power integrity analysis to match analog content in today’s designs
Siemens introduces mPower to bridge the analog-to-digital gap in IR-drop and EM analysis, reflecting the scaling trends in today's ICs.
EDA
Siemens brings chip-design flow to DARPA Toolbox Initiative
Siemens EDA has become the first of the major EDA vendors to join the DARPA Toolbox Initiative.
Digital twins manage change in E/E design for aerospace
A three-pronged digital twin strategy can help aviation and defense companies master increasing complexity in electrical implementations.
Cadence organizes on-device AI into three families
Cadence has organized its machine-learning platforms into three families intended to cover a wide range of on-device AI applications.
Connected cars call for safety islands
A Siemens Tessent white papers examines the role of safety islands in advanced automotive systems.
Overcome reset domain crossing challenges when using UPF
A DVCon technical paper addresses potential reset domain crossing metastability issues due to UPF instrumentation.
Practical steps toward ECAD-MCAD integration for automotive design
The need for the electrical and mechanical design domains to inform one another in more detail is recognized, but how do you do it?
Automate latchup verification for 3DIC
A Siemens white paper describes a way of automatically deriving information from 2.5D/3DIC designs to streamline latchup design-rules verification.
Learn how to apply formal verification to safety-critical aviation designs
A detailed technical overview of formal verification within the context of the DO-254 (ED-80) standard is now available to download.
Cadence uses reinforcement learning to tune flow
Cadence has launched a tool that the company claims can speed up implementation by applying machine learning across the flow.
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