X-Fab adds galvanic isolation to CMOS process
X-Fab has made it possible to put galvanic isolation based on capacitive coupling directly into chips made on its XA035 process.
power domains
Scaling power integrity analysis to match analog content in today’s designs
Siemens introduces mPower to bridge the analog-to-digital gap in IR-drop and EM analysis, reflecting the scaling trends in today's ICs.
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