Building products using chiplets involves more than treating them as hard IP cores. Many open questions surround the field, explored by panelists in a MEPTEC conference online.
Early-access customers talked about their experiences with the Synopsys Fusion-based flow in a panel session at the DAC.
Companies such as Broadcom are experiencing threefold test-pattern reductions through the use of automatically inserted gates that allow parallel cones to share the same ATPG patterns that would not be possible using conventional test generation schemes.
Last week's announcement by Avago that it would buy Broadcom looks to be only partly about bulk. The merger could help drive SIP and 3DIC integration.
Conference addresses formal verification techniques at levels to suit beginners through to experts
Comms giant to seek out more local partnerships with China poised to account for a third of car sales with each new vehicle featuring 1,000 semis.
Building the internet of Things will demand collaboration and a healthy ecosystem
Imagination Technologies has set up an open-source effort that mirrors ARM's Linaro group and cut a deal with Oracle for Java optimization.
Managing finFET variability issues without extending design times is key to extracting the most from the new processes, key players told a panel at the recent SNUG meeting in Santa Clara.
The group that developed the IEEE 1801 Unified Power Format standard is looking to bringing power modeling and estimation to the system level for version 3.0, due in 2015.
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