Chipmaker

Graphics and AI specialist nVidia has been confirmed as the buyer of Arm from Softbank Vision Fund in a transaction worth up to $40bn, with the fund retaining a 10 per cent share in Arm if the deal completes.

TSMC is using its growing experience with EUV lithography to fill in sub-nodes between its major releases as it prepares to extend finFET technology to the forthcoming N3 process.

An RF Laboratories engineer provides some tips and techniques in the context of the PADS Professional suite.

Arm works with EDA to find new efficiencies based on extra CTL-based check in Questa runs.

Mentor adds Analog FastSPICE eXTreme innovations for designs facing increasing parasitic complexity and contact resistance challenges at cutting edge nodes.

Heterogeneous integration has the potential to overcome the yield and cost challenges presented by the growing headwinds associated with process scaling. But it may take a dramatic rethink in design approaches.

In a panel session at VLSI Symposia, AMD described how the economics have come down strongly in favor of multichip integration for multicore server processors.

Arm is to return to focusing on semiconductor IP following the decision to spin out its IoT operations to separate groups within the Softbank empire.

The organizers of DVCon Europe have decided to turn the autumn verification conference into a virtual event this year.

Sigasi has launched a software kit to provide inhouse tools builders and EDA vendors with a way to build in code-editing features.