Marvell

July 19, 2021

Chiplet design raises big questions

Building products using chiplets involves more than treating them as hard IP cores. Many open questions surround the field, explored by panelists in a MEPTEC conference online.

Article | Topics: Blog - EDA, IP, PCB | Tags: chiplet, RDL, silicon interposer, SIP, SoC | Organizations: Broadcom, Intel, Marvell, MEPTEC

May 2, 2018

User2User Silicon Valley rolls out later this month

Mentor's west coast user conference will take place in Santa Clara on May 15. Attendance is free-of-charge.

Article | Topics: Conferences, Blog - EDA | Tags: | Organizations: Cisco, Cypress Semiconductor, Marvell, Microsoft, nVidia, Samsung Electronics, Siemens EDA, Starblaze Technology, STMicroelectronics

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