Cadence Design Systems

February 2, 2016

Cadence boosts compression with physical DFT tool

Cadence has use physically aware placement in a test tool that promises less routing congestion for scan test and which increases the potential for stimulus compression.
Article  |  Topics: Blog - EDA  |  Tags: , ,   |  Organizations:
December 18, 2015

Accellera and Mentor’s Dennis Brophy talks standards targets and DVCon

Driving down energy consumption for the IoT, making portable stimulus deliver real benefits and the practical benefts of a globalizing DVCon.
December 7, 2015

Cadence partners for photonic IC design

Cadence Design Systems has worked with Lumerical Solutions and PhoeniX Software to develop a flow for designing photonic ICs based on the Virtuoso custom-design platform.
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November 16, 2015

Cadence shifts emulation to the data center

Cadence Design Systems has designed its Palladium Z1 emulator to fit into the corporate data-center, improving virtualization and availability aspects of the system’s design.
Article  |  Topics: Blog - EDA, Embedded  |  Tags: , , ,   |  Organizations:
November 12, 2015

DVCon Europe: UVM-SystemC backers ready first draft

But the bridge standard's European backers still need greater support from the big EDA vendors.
October 9, 2015

IMEC 5nm test chip to explore EUV and SAQP litho options

IMEC and Cadence have taped out a test chip intended to explore key lithography and metal-interconnect issues that will face users of the forthcoming 5nm process node.
Article  |  Topics: Blog - EDA  |  Tags: , , , ,   |  Organizations: ,
October 6, 2015

Tensilica vision processor cuts power through memory changes

Memory efficiency has driven the design of the latest video and image processor core developed by Cadence Tensilica.
July 15, 2015

PSpice builds interfaces to PCB and system-level cosimulation

The need for virtual prototyping at the PCB-design has led to changes in the way PSpice is being used – with much greater emphasis on cosimulation.
Article  |  Topics: Blog - PCB  |  Tags: , , ,   |  Organizations:
June 18, 2015

The road to 7nm sees patterning multiply

Is the industry ready to go beyond 10nm when it comes to lithography? Lithography researcher Professor David Pan sees design and process co-operation as the key approach.
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June 16, 2015

Collaboration let HiSilicon accelerate 16nm finFET plans

HiSilicon claims close collaboration with foundry and EDA tools partners helped speed up plans to tape out the first 16nm finFET-based design through TSMC.

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