About Luke Collins
Luke Collins has spent 22 years covering electronics, EDA and innovation. He is a former Editor-in-Chief of Electronics Times in the UK, and co-founded the international IP9x conference series on semiconductor IP. Luke's work has also appeared in The Economist, The Financial Times and Reseach-Technology Management.
March 19, 2013
The chip industry faces problems as foundries and the packaging industry compete over 3D technologies. If resolved, it could mean a new dawn in ASIC design.
March 19, 2013
STMicroelectronics pushes on with FDSOI despite dissolution of ST-Ericcson joint venture that provided the lead customer for the process.
February 26, 2013
Intel's announcement that it will make FPGAs for Altera in an upcoming 14nm finFET process will reshape the programmable logic, and foundry, businesses.
January 30, 2013
Mentor's HyperLynx gets speed and accuracy enhancements, as well as more embedded help, to speed up fast board design
December 13, 2012
3D-IC integration techniques such as the use of TSVs, die stacking and interposers are unlikely to limit performance, according to research from TSMC and IBM
December 12, 2012
How to save money in process development by moving experiments out of the fab and into the computer.
December 11, 2012
Can planar devices on fully depleted SOI resist the relentless rise of finFETs as the next device architecture of choice for the semiconductor industry? An evening panel at IEDM explored the trade-offs
December 11, 2012
Semiconductor process options outlined at IEDM by Luc van den Hove of imec as industry faces hard choices and rising costs
October 25, 2012
Ambipolar FETs, which can be n or p-type dependent on a control gate, could offer a new way to design circuits at 20nm and below.
October 24, 2012
Using a tile-based analog design methodology to produce power application controller ICs at Active-Semi