EDA and IP vendors roll out support for TSMC’s 20nm, 3DIC processes
IP and EDA vendors line up to support TSMC 20nm process, CoWoS 3DIC technology
Author Archives: Luke Collins
FinFETs face planar fightback at IEDM
Advanced SOI devices with hybrid channel materials may challenge the finFET's future dominance, says IBM
imec ITF: EUV source power woes threaten Moore’s Law scaling
EUV sources currently deliver around 10 to 15W, but need to be delivering 200W to make them cost effective for production use. Can the industry boost source power by 2014, or are we stuck with slower scaling?
Intel, TSMC finFETs to star at IEDM
Intel finFET family grows to support SoC use, as TSMC boosts p-channel performance with germanium
TSMC joins Intel as ASML investor to accelerate availability of EUV, 450mm lithography
TSMC follows Intel in taking a stake in ASML to accelerate development of EUV and 450mm lithography equipment.
Chip design – easier than semiconductor IP?
Software-defined-modem IP licensing company Cognovo acquired to help build end products.
Webinar on model-driven design for soft modems
Cognovo is running a webinar next week (19 June) on model-driven design for software-defined wireless modems.
DAC2012: Collaboration key to success at 20nm
Foundries can’t hand down design rules on tablets of stone any more - success at 20nm will take close collaboration with customers and tool vendors
DAC2012: Rethink tools licensing for cloud computing, EDA Industry told
Could more flexible licensing strategies for cloud-based EDA enable more efficient simulation and a new wave of business models?
DAC2012: Sagantec offers lifebelt to 28nm users, path to 20nm libraries
Can process migration tools help the yield-challenged and speed the path to 20nm?