TSMC

December 16, 2013

TSMC hints at glass interposer for mobile SoCs

Glass may be the high frequency interposer option given silicon concerns about power and noise. TSMC adds another pathfinder to its 3D arsenal.
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November 13, 2013

TSMC succession plan emphasizes stability

TSMC stays the course with new co-CEOs as Morris Chang retains executive leadership for now while finFET, 3D and other new technologies settle in.
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November 7, 2013

TSMC demonstrates readiness for 3D-IC

Research projects to verify methodologies, address third-party integration challenges and add a low-cost interposer-like technology to the 3D-IC family make their mark.
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October 23, 2013

3D-IC focus for GSA’s Taipei Memory+ event next week

Packed one-day event has speakers from Cadence, TSMC, Samsung, Amkor, Advantest and more providing a senior level view of making 3D-IC a reality. Registration closes soon.
October 1, 2013

TSMC 16nm finFET, Ge 20nm p-finFET set for IEDM

TSMC 16nm finFET process and efforts to increase p-finFET mobility using germanium to be detailed at December's International Electron Devices Meeting.
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June 10, 2013

Altera outlines process roadmap for ‘Gen 10’ FPGAs

Altera has disclosed a number of the features that will make it into the top end of its upcoming 'Generation 10' family of FPGAs.
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June 7, 2013

FinFET shift could drive analog automation as layout effects bite

The arrival of the finFET brings with it simulation and physical restrictions that might lead teams to resort to layout automation to get the job done.
May 29, 2013

TSMC and Xilinx forge tighter bonds to speed up finFET port

Xilinx and TSMC are forming a single engineering team to accelerate development of a family of finFET-based field programmable gate arrays (FPGAs).
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May 22, 2013

DAC 2013 Preview IX: Manufacturability

A look at what you can learn about design for manufacturability and yield at this year's Design Automation Conference
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April 10, 2013

FinFET father headlines Mentor’s west coast user conference

Dr Chenming Hu joins Mentor CEO Wally Rhines and Xilinx SVP Victor Peng to keynote free day-long User2User in San Jose on April 25th, capping a full technical program.
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