TSMC

August 6, 2012

TSMC joins Intel as ASML investor to accelerate availability of EUV, 450mm lithography

TSMC follows Intel in taking a stake in ASML to accelerate development of EUV and 450mm lithography equipment.
Article  |  Topics: Commentary, Design to Silicon  |  Tags: , ,   |  Organizations: , ,
August 6, 2012

Aart de Geus on the changing face of EDA

The president and co-CEO of Synopsys provides his take on the mounting influence of software and physical effects in the creation of SoCs.
Article  |  Topics: Commentary, Design to Silicon, Blog - EDA, Embedded, - General, Verification  |  Tags: , , ,   |  Organizations: , ,

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