TSMC

December 13, 2012

3D-IC integration prospects improving, say IEDM researchers

3D-IC integration techniques such as the use of TSVs, die stacking and interposers are unlikely to limit performance, according to research from TSMC and IBM
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October 16, 2012

EDA and IP vendors roll out support for TSMC’s 20nm, 3DIC processes

IP and EDA vendors line up to support TSMC 20nm process, CoWoS 3DIC technology
October 11, 2012

Intel, TSMC finFETs to star at IEDM

Intel finFET family grows to support SoC use, as TSMC boosts p-channel performance with germanium
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October 9, 2012

TSMC updates reference flows for 20nm and CoWoS

TSMC has released two reference flows – one for its 20nm and the other for the form of 3D integration favored by the Taiwanese foundry, chip on wafer on substrate (CoWoS).


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October 9, 2012

Event alert: TSMC Open Innovation Platform

With the foundry giant set to take the wraps off its latest flows and innovations in just seven days, remember that you must pre-register to attend its Silicon Valley event. Also here are some pre-event pointers.
October 4, 2012

IEF: Achronix plans embedded FPGA push

Achronix plans to use the FPGA fabric that it has developed for standalone products to be fabbed through Intel as the springboard for an embedded-FPGA offering.
Article  |  Topics: Conferences, Design to Silicon, Blog - EDA, - General  |  Tags: , , , ,   |  Organizations: , ,
August 6, 2012

TSMC joins Intel as ASML investor to accelerate availability of EUV, 450mm lithography

TSMC follows Intel in taking a stake in ASML to accelerate development of EUV and 450mm lithography equipment.
Article  |  Topics: Commentary, Design to Silicon  |  Tags: , ,   |  Organizations: , ,
August 6, 2012

Aart de Geus on the changing face of EDA

The president and co-CEO of Synopsys provides his take on the mounting influence of software and physical effects in the creation of SoCs.
Article  |  Topics: Commentary, Design to Silicon, Blog - EDA, Embedded, - General, Verification  |  Tags: , , ,   |  Organizations: , ,

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