New flow enables high-performance, high-integration designs.
Solido aims to bring the types of machine-learning techniques the company has used for its physical-analysis tools to a wider range of EDA tools through the launch of its ML Labs initiative.
Managing finFET variability issues without extending design times is key to extracting the most from the new processes, key players told a panel at the recent SNUG meeting in Santa Clara.
The effort needed in timing signoff could lead to a shift in design towards asynchronous techniques unless advanced OCV technologies improve.
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